| Title: |
Comparison of 3D manifold architectures for cooling of internal heatsinks using external airflow |
| Authors: |
Farrell, G.; Nimmagadda, R.; Joshi, S. N.; Lohan, D. J.; Dede, E. M.; Persoons, T. |
| Source: |
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2025 24th IEEE Intersociety Conference on. :1-10 May, 2025 |
| Relation: |
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Database: |
IEEE Xplore Digital Library |