| Title: |
Development of Liquid Metal and Silicon Pin Fin Composite Thermal Interface Materials |
| Authors: |
Coughlin, Matthew; Clements, Andrew; Wang, Fangzhou; Min, Luke Gyubin; Jiang, Kaiying; Kwon, Heungdong; Asheghi, Mehdi; Goodson, Kenneth |
| Source: |
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2025 24th IEEE Intersociety Conference on. :1-9 May, 2025 |
| Relation: |
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Database: |
IEEE Xplore Digital Library |