Equivalent Lumped Element Model for Electromigration Considering Thermal Effects
| Title: | Equivalent Lumped Element Model for Electromigration Considering Thermal Effects |
|---|---|
| Authors: | Zhu, Hengyi; Zhu, Wenjie; Hou, Tianshu; Ji, Zhigang; Wang, Runsheng; Tang, Min; Chen, Hai-Bao |
| Source: | 2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2025 IEEE/ACM International Conference On. :1-9 Oct, 2025 |
| Relation: | 2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD) |
| Database: | IEEE Xplore Digital Library |