| Title: |
Improving Board-Level Reliability of Large BGA Packages via Edgebond Placement |
| Authors: |
Shih, Meng-Kai; Lin, Si-Wei; Ding, Yuan-Hong; Hsieh, Chin-Ju; Chang, Simon |
| Source: |
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2025 20th International. :86-89 Oct, 2025 |
| Relation: |
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |