| Title: |
Reliability Characterization of Vacuum Printable Compound for SiP Encapsulation in Wireless Connectivity : USI Corporation |
| Authors: |
Wang, Chao-Hsuan; Shen, Li-Cheng; Tsai, Hung-Yi; Liao, Kuo-Hsien; Chang, Chung-Ping; Cheng, Hsiu-Lieh; Chang, Ming-Hung; Wu, Tai-Lin; Wu, Heng-Chang; Hong, Ping-Chi; Hung, Yu-Feng |
| Source: |
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2025 20th International. :126-129 Oct, 2025 |
| Relation: |
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |