Warpage Resistance of Glass Substrate Containing Through-Glass-Vias: A Numerical Analysis
| Title: | Warpage Resistance of Glass Substrate Containing Through-Glass-Vias: A Numerical Analysis |
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| Authors: | Shen, Yu-Lin; Li, Luo |
| Source: | 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2025 20th International. :355-358 Oct, 2025 |
| Relation: | 2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: | IEEE Xplore Digital Library |