High I/O Density Solution on Flip Chip Substrate for Advanced Package
| Title: | High I/O Density Solution on Flip Chip Substrate for Advanced Package |
|---|---|
| Authors: | Ni, Yuan-Chang; Chen, Hung Kun; Pai, Yu Cheng; Kang, Cheng Yu; Chen, Jen Shang; Chu, Wei Ching; Wang, Yu-Po; Jiang, Don-Son |
| Source: | 2025 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2025 IEEE. :44-47 Nov, 2025 |
| Relation: | 2025 IEEE CPMT Symposium Japan (ICSJ) |
| Database: | IEEE Xplore Digital Library |