Addressing STEM Specimen Preparation Challenges in Advanced-Node FinFET Devices
| Title: | Addressing STEM Specimen Preparation Challenges in Advanced-Node FinFET Devices |
|---|---|
| Authors: | Cheng, Matthew; Kumar, Abinash; Schwarz, Stephen; Perko, Ed; Williams, Henry; Prenitzer, Brenda |
| Source: | 2025 IEEE Physical Assurance and Inspection of Electronics (PAINE) Physical Assurance and Inspection of Electronics (PAINE), 2025 IEEE. :1-7 Oct, 2025 |
| Relation: | 2025 IEEE Physical Assurance and Inspection of Electronics (PAINE) |
| Database: | IEEE Xplore Digital Library |