A Compact and Layered MMIC Packaging Solution Based on MLCL for Terahertz Applications
| Title: | A Compact and Layered MMIC Packaging Solution Based on MLCL for Terahertz Applications |
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| Authors: | Wang, B.; Zhou, Z.; Zhang, L.; Gao, G.; Simon He, Z.; Yu, W. |
| Source: | IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 74(4):3529-3537 Apr, 2026 |
| Database: | IEEE Xplore Digital Library |