| Title: |
Towards SoCs leveraging 200nm wafer-to-wafer interconnection pitch |
| Authors: |
De Vos, Joeri; Myers, James; Van Huylenbroeck, Stefaan; Witters, Liesbeth; Chery, Emmanuel; Stucchi, Michele; Zhao, Peng; D'have, Koen; Vanrusselt, Maxim; Iacovo, Serena; Tsai, Hung-Chieh; Dewilde, Sven; Bogaerts, Lieve; Heyvaert, Cindy; Chew, Soon Aik; Zhang, Boyao; Kang, Shuo; Brunion, Moritz; Biswas, Dwaipayan; Beyer, Gerald; Van der Plas, Geert; Tokei, Zsolt; Beyne, Eric |
| Source: |
2025 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2025 IEEE International. :1-4 Dec, 2025 |
| Relation: |
2025 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |