| Title: |
Sub-micron AlN Films with High Thermal Conductivity and Electrical Resistivity for Efficient Heat Dissipation in 3D ICs |
| Authors: |
Vaziri, S.; Huang, X.; Hou, S.; Datye, I. M.; He, C.; Ying, J. F.; Wu, X.; Hsu, C. F.; Min, L. G.; Kwon, H.; Chen, S.; Chiang, C.; Woon, W. Y.; Liao, S. S.; Asheghi, M.; Goodson, K. E.; Pop, E.; Wong, H.-S. Philip; Bao, X. Y. |
| Source: |
2025 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2025 IEEE International. :1-4 Dec, 2025 |
| Relation: |
2025 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |