| Title: |
A Sequence-to-Sequence Multi-Fidelity Surrogate Modeling Approach for the Reflow Soldering Process |
| Authors: |
Wei, Xiaohan; Zhang, Qing; Back, Thomas; Wang, Hao |
| Source: |
2025 7th International Conference on Robotics, Intelligent Control and Artificial Intelligence (RICAI) Robotics, Intelligent Control and Artificial Intelligence, 2025 7th International Conference on Robotics, Intelligent Control (RICAI). :822-826 Nov, 2025 |
| Relation: |
2025 7th International Conference on Robotics, Intelligent Control and Artificial Intelligence (RICAI) |
| Database: |
IEEE Xplore Digital Library |