Investigation of Cu Bonding Wire Lifetime Under Accelerated Temperature Environments
| Title: | Investigation of Cu Bonding Wire Lifetime Under Accelerated Temperature Environments |
|---|---|
| Authors: | Azuma, Shinya; Araki, Noritoshi; Eto, Motoki; Yamada, Takashi |
| Source: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-6 Dec, 2025 |
| Relation: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |