| Title: |
Efficient Construction of Wafer-Scale InP/Si and InP InP/LiNb3 Heterointerfaces via Quasi-Direct Bonding Strategy |
| Authors: |
Kang, Qiushi; Ding, Fei; Jin, Renxi; Zhang, Yu; Yang, Yudong; Yang, Haibo; Zhang, Hongchao; Zhang, Lingyun; Wang, Qidong |
| Source: |
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-6 Dec, 2025 |
| Relation: |
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |