Effect of Glass and Mold Material on Over Molded Glass Wafer Warpage in FOWLP and 2.5D Applications
| Title: | Effect of Glass and Mold Material on Over Molded Glass Wafer Warpage in FOWLP and 2.5D Applications |
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| Authors: | Manyi, Pan; Lin, Ji; Siang, Sharon Lim Pei; Tupaen, Hipona Randy; Boon, Serine Soh Siew; Choong, Chong Ser |
| Source: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-5 Dec, 2025 |
| Relation: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |