| Title: |
Enhancing Wafer Bonding Strength Via Surface and Dielectric Modification Using Plasma Activation Process |
| Authors: |
Park, Jaehyung; Kim, Jihun; Lee, Junghan; Jang, Myeonggon; Min, Junhong; Cho, Sohye; Ji, Hyewon; Park, Jintae; Jang, Joohee; Kim, Sekho; Lim, Dongchan; Lee, Sungho; Lee, Hojin; Lee, Seunghun; Hyun, Sangjin |
| Source: |
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-6 Dec, 2025 |
| Relation: |
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |