UV-Assisted Fluxless Bonding for Advanced Packaging: Interfacial Mechanisms and Reliability Assessment
| Title: | UV-Assisted Fluxless Bonding for Advanced Packaging: Interfacial Mechanisms and Reliability Assessment |
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| Authors: | Kim, You-Gwon; Yoo, Dong-Hoon; Park, Hyeong-Bin; Park, Jong-Whi; Kim, Hak-Sung; Shin, Seungchul; Kang, Dongsuk |
| Source: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-6 Dec, 2025 |
| Relation: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |