Backside Metal Interconnect for High Performance RF Interposer
| Title: | Backside Metal Interconnect for High Performance RF Interposer |
|---|---|
| Authors: | LIM, Teck Guan; Ching, Eva Wai Leong; Tippabhotla, Sasi Kumar; Feng, Huicheng; Wu, JiaQi |
| Source: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-6 Dec, 2025 |
| Relation: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |