Low-Temperature Pressure-Assisted Sintering of Oxidation-Resistant Cu Paste for Large-Area Interconnects in Power Electronics Packaging
| Title: | Low-Temperature Pressure-Assisted Sintering of Oxidation-Resistant Cu Paste for Large-Area Interconnects in Power Electronics Packaging |
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| Authors: | Lin, Xiaoting; Cen, Wei; Zhan, Shizhi; Wu, Hao; Cao, Siyu; Li, Junjie |
| Source: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-6 Dec, 2025 |
| Relation: | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |