| Title: |
Extended Isothermal Ageing of Cu-Al Intermetallic Joints: Comparative Wear-Out Study and Characterization Methods for Pure and Alloyed Copper Wires |
| Authors: |
Caputo, Onofrio Davide; Losacco, Gabriele; Mancaleoni, Alberto; Carluccio, Roberta; Villa, Riccardo; Serafini, Andrea; Colombo, Alexandra; Bonera, Emiliano |
| Source: |
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2025 IEEE 27th. :1-8 Dec, 2025 |
| Relation: |
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |