Design and Manufacturing of Double-Sided SiP Power Modules via Temporary Carrier-Based Process
| Title: | Design and Manufacturing of Double-Sided SiP Power Modules via Temporary Carrier-Based Process |
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| Authors: | Wu, P.; Liao, L.; Sun, G.; Liu, Z.; Liu, M.; Teng, X.; Qiu, Y.; Fu, L.; Zhu, W.; Wang, L. |
| Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manuf. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 16(4):899-907 Apr, 2026 |
| Database: | IEEE Xplore Digital Library |