| Title: |
17.3 ARIES and REGULUS: A Unified and Scalable hardware–software co-designed NPU SoC Family for On-Device and On-Premises Multimodal Inference |
| Authors: |
Shin, D.; Yang, H.; Jeon, S.; Park, J.; Han, S.; Lee, J.; Kim, J.; Kim, H.; Oh, Y.; Kim, M.; Jung, C.; Kim, W.; Kim, S.; Jeong, H.; Kim, G.; Lee, K.; Song, G.; Min, Y.; Song, C.; Kanybek, A.; Jung, Y.; Song, J.; Cho, S.; Na, H.; Si, D.; Lee, B.; Park, B.; Jeon, H. |
| Source: |
2026 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2026 IEEE International. 69:302-304 Feb, 2026 |
| Relation: |
2026 IEEE International Solid-State Circuits Conference (ISSCC) |
| Database: |
IEEE Xplore Digital Library |