| Title: |
8.2 A 32Gb/s 12.35Tb/s/mm2 0.36pJ/b UCIe-Like Die-to-Die Interface Featuring Edge-Triggered Transceivers in 3nm with Active LSI Packaging |
| Authors: |
Chen, Wei-Chih; Lin, Mu-Shan; Tsai, Chien-Chun; Li, Shenggao; Lin, Wei-Shuo; Huang, Yu-Jie; Cheng, Nai-Chen; Chen, Yu-Chi; Huang, Wen-Hung; Wen, Chin-Hua; Kuo, Hsin-Hung; Ke, Han-Tzung; Huang, Jie-Ren; Li, Chang-Yi; Lai, Sheng-Tsung; Yang, Shu-Chun; Chou, Kuan-Ting; Chiou, Pei-Chen; Tsai, Tsung-Hsien; Chen, Yi-Ting; Chen, Yen-Ming; Hsieh, Kenny Cheng-Hsiang |
| Source: |
2026 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2026 IEEE International. 69:136-138 Feb, 2026 |
| Relation: |
2026 IEEE International Solid-State Circuits Conference (ISSCC) |
| Database: |
IEEE Xplore Digital Library |