| Title: |
7.1 54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation |
| Authors: |
Dutton, Neale A. W.; Branca, Xavier; Thivin, Mathieu; Collins, Steven; Thuaire, Herve; Martin, Fabrice; Clemencon, Vincent; Al-Rawhani, Mohammed; Hall, Duncan; Crocherie, Axel; Pastorelli, Cedric; Taupin, Sophie; Trochut, Severin; Singh, Abhishek; Assmann, Andreas; Rae, Bruce R.; Mellot, Pascal |
| Source: |
2026 IEEE International Solid-State Circuits Conference (ISSCC) Solid-State Circuits Conference (ISSCC), 2026 IEEE International. 69:112-114 Feb, 2026 |
| Relation: |
2026 IEEE International Solid-State Circuits Conference (ISSCC) |
| Database: |
IEEE Xplore Digital Library |