| Title: |
Compact 3D-SiP Power IC Packaging with Thermal Performance Improvement |
| Authors: |
Tsai, Poyu; Lin, Hsin-Han; Huang, I-Cheng; Huang, Hung-Hsien; Lin, Cheng-Nan; Kao, Gavin; Lu, Shihwen; Wang, Alexcc; Chuang, Arbie; Chang, Harrison |
| Source: |
2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2025 IEEE Electrical Design of. :1-3 Dec, 2025 |
| Relation: |
2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) |
| Database: |
IEEE Xplore Digital Library |