| Title: |
Temperature Dependence of Threshold Voltage for Interconnect IDDQ Testing in 3D Stacked ICs Using an Offset-Cancellation-Type Comparator |
| Authors: |
Ohmori, Haruto; Hashizume, Masaki; Ali, Fara Ashikin Binti; Lu, Shyue-Kung; Yotsuyanagi, Hiroyuki |
| Source: |
2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2025 IEEE Electrical Design of. :1-4 Dec, 2025 |
| Relation: |
2025 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) |
| Database: |
IEEE Xplore Digital Library |