| Title: |
Influence of solder bumps-induced mechanical constraint on the performance of BJT ring oscillators |
| Authors: |
Dahmani, M.; Gallois-Garreignot, S.; Dugor, M.; Van-Haaren, B.; Broussous, L.; Boutonnat, C.; Belfils, F.; Cagli, C. |
| Source: |
2026 IEEE 38th International Conference on Microelectronic Test Structures (ICMTS) Microelectronic Test Structures (ICMTS), 2026 IEEE 38th International Conference on. :1-4 Mar, 2026 |
| Relation: |
2026 IEEE 38th International Conference on Microelectronic Test Structures (ICMTS) |
| Database: |
IEEE Xplore Digital Library |