| Title: |
Development of a Flip-Chip Bonding Process for Scalable Silicon-Based Quantum Processors |
| Authors: |
Van, V. K. H.; Bohemier, C.; Ramirez, S. S.; Wreyford, R.; Dash, A.; Dickie, A.; Yianni, S. A.; Hudson, F. E.; Lim, W. H.; Dzurak, A. S.; Chan, K. W. |
| Source: |
2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2026 10th IEEE. :1-3 Mar, 2026 |
| Relation: |
2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) |
| Database: |
IEEE Xplore Digital Library |