Electromigration Performance and Underlying Mechanism in CoWoS Packaging
| Title: | Electromigration Performance and Underlying Mechanism in CoWoS Packaging |
|---|---|
| Authors: | Chu, David T.; Tang, Sherwin; Chang, Jui-Shen; Chiu, Chung-Yu; Chiu, Chen-Nan; Lin, M.H.; Wu, Jyun-Lin; Chuang, Yao-Chun; Lu, Ryan |
| Source: | 2026 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2026 IEEE International. :1-6 Mar, 2026 |
| Relation: | 2026 IEEE International Reliability Physics Symposium (IRPS) |
| Database: | IEEE Xplore Digital Library |