| Title: |
Effects of Packaging & Implantation Temperature on 1.2-kV SiC MOSFET Reliability Under HVDC-H3 TRB Stress |
| Authors: |
Rummel, B.D.; Mancini, S.A.; Erlbaum, J.; Glaser, C.E.; Remple, C.; Floyd, R.; Binder, A.T.; Mueller, J.; Jang, S.Y.; Morgan, A.; Kaplar, R.J.; Sung, W. |
| Source: |
2026 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2026 IEEE International. :1-5 Mar, 2026 |
| Relation: |
2026 IEEE International Reliability Physics Symposium (IRPS) |
| Database: |
IEEE Xplore Digital Library |