A 51.19 mm2, 4 TB/s bandwidth 3D Logic-on-SRAM Stacking CGRA Chip
| Title: | A 51.19 mm2, 4 TB/s bandwidth 3D Logic-on-SRAM Stacking CGRA Chip |
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| Authors: | Dong, Zizheng; Yin, Chen; Liu, Pengyu; Li, Shuaipeng; Li, Ang; Zhu, Weijia; He, Weifeng; He, Guanghui; Wang, Qin; Sun, Yanan; Mao, Zhigang; Jing, Naifeng; Jiang, Jianfei |
| Source: | 2026 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2026 IEEE. :1-5 Apr, 2026 |
| Relation: | 2026 IEEE Custom Integrated Circuits Conference (CICC) |
| Database: | IEEE Xplore Digital Library |