| Title: |
Applying the Global-Local Approach with the Equivalent Structure for Reliability Assessment of the Multilevel Area Array Interconnects |
| Authors: |
Yuan, Cadmus; Lin, Si-Han; Hong, Jian-Cheng |
| Source: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-7 Apr, 2026 |
| Relation: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |