| Title: |
Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation |
| Authors: |
Kuttler, Simon; Van Dijk, Marius; Wittler, Olaf; Schneider-Ramelow, Martin |
| Source: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-4 Apr, 2026 |
| Relation: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |