| Title: |
Physics-of-Failure Based Reliability Investigations of Copper Sintered Die Attaches for Wide Band Gap Power Electronics |
| Authors: |
Heilmann, J.; Wittwer, P.; Schuh, J.; Grosse-Kockert, C.; Stelzer, A.; Busse, D.; Ras, M. Abo; Wunderle, B. |
| Source: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-9 Apr, 2026 |
| Relation: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |