| Title: |
Compact Thermal Model of a Multi Die Power Stage with In-Package Sensing for Remaining Useful Life Prediction |
| Authors: |
Bergmann, Ole J.; van Zeijl, Henk W.; van Driel, Willem D.; Qi Zhang, Guo; Poelma, Rene H. |
| Source: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-8 Apr, 2026 |
| Relation: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |