| Title: |
Constitutive Model Identification for Aluminum Wires and Potting Resin used in IGBT Power Modules |
| Authors: |
Chedozeau, Clement; Ouhab, Merouane; Vermaak, Natasha; Hild, Francois |
| Source: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2026 27th International Conference on. :1-10 Apr, 2026 |
| Relation: |
2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Database: |
IEEE Xplore Digital Library |