Broadband Interconnect and Assembly for Sub-THz Heterogeneous Integration
| Title: | Broadband Interconnect and Assembly for Sub-THz Heterogeneous Integration |
|---|---|
| Authors: | Chartier, Sebastien; Holc, Katarzyna; Stenzel, Damian; Gashi, Bersant; Tessmann, Axel; Leuther, Arnuf; Merkert, Patricie |
| Source: | 2026 17th German Microwave Conference (GeMiC) German Microwave Conference (GeMiC), 2026 17th. :184-187 Mar, 2026 |
| Relation: | 2026 17th German Microwave Conference (GeMiC) |
| Database: | IEEE Xplore Digital Library |