Silicon Interposer with Advanced RF Technology Modules for BiCMOS Wafer-Level Packaging
| Title: | Silicon Interposer with Advanced RF Technology Modules for BiCMOS Wafer-Level Packaging |
|---|---|
| Authors: | Wietstruck, Matthias; Kruger, Patrick; Vos, Thomas; Schulze, Sebastian; Bashir, Muhammad F.; Wipf, Selin Tolunay; Durmaz, Emre C.; Joy, Kanaka; Hasnayen, Nafis; Sutbas, Batuhan |
| Source: | 2026 17th German Microwave Conference (GeMiC) German Microwave Conference (GeMiC), 2026 17th. :176-179 Mar, 2026 |
| Relation: | 2026 17th German Microwave Conference (GeMiC) |
| Database: | IEEE Xplore Digital Library |