| Title: |
In-situ observation of dislocation movement, accumulation and crack propagation during tensile loading in Sn and Sn-based solder alloys |
| Authors: |
Nogita, Kazuhiro; Zhou, Jiye; Tan, Xin F.; McDonald, Stuart D.; Sweatman, Keith; Maeno, Hiroshi; Matsumura, Syo; Yasuda, Kazuhiro |
| Source: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on. :295-296 Apr, 2026 |
| Relation: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) |
| Database: |
IEEE Xplore Digital Library |