| Title: |
New Advanced Packaging Architecture: CoWoP (Chip on Wafer on Platform PCB) |
| Authors: |
Hsu, Terry; Yang, HueiChi; Zhuang, Ming-Han; Lin, Sam; Lin, Vito; Kang, Andrew; Jiang, Don Son |
| Source: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on. :25-26 Apr, 2026 |
| Relation: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) |
| Database: |
IEEE Xplore Digital Library |