| Title: |
Capillary Underfill Simulation across Die-to-Die Gap Using Hybrid EBG Modeling |
| Authors: |
Shen, Leo; Noguchi, Kazuki; Liang, Yu-En; Lin, Wei-Yu; Wei, Zi-Hsuan; Chou, Ching-Kai; Lin, Ming-Yu |
| Source: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on. :291-292 Apr, 2026 |
| Relation: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) |
| Database: |
IEEE Xplore Digital Library |