| Title: |
Tensile properties of Sn-37Bi-0.5Sb-0.5Cu-0.03Ni low-temperature soldering alloy |
| Authors: |
Ye, Xiaozhou; McDonald, Stuart D; Tan, Xin Fu; Nishimura, Takatoshi; Sweatman, Keith; Nogita, Kazuhiro |
| Source: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS), 2026 International Conference on. :193-194 Apr, 2026 |
| Relation: |
2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) |
| Database: |
IEEE Xplore Digital Library |