| Title: |
Materials Integration of Ultra-Wide Bandgap and Piezoelectric Thin Films |
| Authors: |
Goorsky, M.S.; Liao, M.E.; Carson, B.; Matto, L.; Pan, K.; Kwon, E.; Long, Y.; Ravi, N. |
| Source: |
2026 9th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2026 9th International Workshop on. :1-1 May, 2026 |
| Relation: |
2026 9th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |