| Title: |
AlN-based Chiplet Encapsulation: Enhancing Thermal Performance for High-density Heterogeneous Integration |
| Authors: |
Victor, Ashita; Go, Dohyun; Lee, Hansol; Mora, Diego Contreras; Kummel, Andrew C.; Bakir, Muhannad S. |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :364-371 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |