| Title: |
Chemical Vapor Deposition (CVD) Diamond-filled Through Vias for Enhanced Vertical Heat Transport in 3D Heterogeneous Integration |
| Authors: |
Yang, Ye; Mendes, Joana Catarina; Neto, Miguel A.; Cabral, Gil; Wei, Tiwei |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :1482-1488 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |