Advanced Scalable Modeling of High-Q Passives on a 300 mm RF Interposer Platform for mmWave and sub-THz Applications
| Title: | Advanced Scalable Modeling of High-Q Passives on a 300 mm RF Interposer Platform for mmWave and sub-THz Applications |
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| Authors: | Wallner, Come; Lederer, Dimitri; Sun, Xiao |
| Source: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :196-203 May, 2026 |
| Relation: | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |