| Title: |
Advanced 3D Packaging Optics Engine with Integrated Micro-VCSEL Array for Ultra-High Bandwidth Optical Interconnect |
| Authors: |
Cheng, Yuk-Tong; Lee, Murphy Chengkang; Lin, Tzu-Hung; Yu, Wang Shi; Ho, Chih-Hsiang; He, Jr-Hau |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :868-872 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |