| Title: |
Through-Glass Via and Substrate Recess Technologies: Enabling Embedded Devices and Co Packaged Optics in Advanced Glass Packaging |
| Authors: |
Anspach, Nils; Heinz, Jannis; Dunker, Daniel; Ambrosius, Norbert; Hirt, Simon; Ostholt, Roman |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :2077-2082 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |