| Title: |
3D Integration of an SRAM chiplet in Fan-Out Embedded Bridge Platform Achieving Low Energy Read/Write |
| Authors: |
Ly-Gagnon, Dany-Sebastien; Chen, Li; Lee, Dwight; Wu, Max; Wang, Jiajing; Liu, Ping-Chen; Yang, Ch; Peng, Chung-Ching; Lin, Steven; Xu, Bruce; Cai, Chung Kang |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :599-604 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |