| Title: |
Electroless Noble Metal Passivation Enabling Oxidation-Free Cu Bonding through a Comparative Study of Au, Pd and Ru for Low-Temperature Hybrid Bonding Applications |
| Authors: |
Go, Byeongchan; Lee, Hoogwan; Komamura, Keiyu; Kishida, Takanori; Kim, Sarah Eunkyung |
| Source: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2026 IEEE 76th. :2198-2201 May, 2026 |
| Relation: |
2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |